Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron

Jaffery, Hasan Abbas and Sabri, Mohd Faizul Mohd and Said, Suhana Mohd and Hasan, Syed Waqar and Sajid, Imran Haider and Nordin, Nor Ilyana Muhd and Megat Hasnan, Megat Muhammad Ikhsan and Shnawah, Dhafer Abdulameer and Moorthy, Chellapilla V.K.N.S.N. (2019) Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron. Journal of Alloys and Compounds, 810. p. 151925. ISSN 0925-8388, DOI https://doi.org/10.1016/j.jallcom.2019.151925.

Full text not available from this repository.
Official URL: https://doi.org/10.1016/j.jallcom.2019.151925


The corrosion behavior of Fe and Bi added Sn-0.7Cu solder was investigated in 3.5 wt% NaCl solution. Addition of Fe and Bi results in higher corrosion current density, reduction in passivation and pseudo passivation domain. Formation of FeSn2 continuously forces the Sn to dissolve, forming SnCl2 and SnCl4. This process generates electric current flow, resulting in a rougher surface. Rougher corrosion products were observed on the surface of modified alloys. The presence of a Bi-rich phase results in galvanic action between Bi and Sn. EIS results show higher capacitance and lower overall electrical resistivity of the modified alloys. © 2019 Elsevier B.V.

Item Type: Article
Funders: University of Malaya under the UMRG Fund ( RP003A/13AET ), Tin Industry (Research and Development) Board, Malaysia ( GA002-2019 )
Uncontrolled Keywords: Lead-free solder alloy; Fe/Bi addition; Interconnect; Potentiodynamic polarization; Electrochemical impedance spectroscopy
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 26 Mar 2020 06:20
Last Modified: 26 Mar 2020 06:20
URI: http://eprints.um.edu.my/id/eprint/24113

Actions (login required)

View Item View Item