Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

Goh, Yingxin and Goh, Yi Sing and Lee, Ee Lynn and Ong, Meng Teck and Haseeb, A.S. Md. Abdul (2018) Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers. Journal of Materials Science: Materials in Electronics, 29 (7). pp. 5791-5798. ISSN 0957-4522, DOI

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Intermetallic compounds (IMC) form during the metallurgical bonding processes when the interfaces involve solid metal and molten solder. Cobalt (Co) is a promising candidate to be used as under bump metallization (UBM) material, tin (Sn)-based solder alloying element, and transient liquid phase bonding base metal. This work aims at studying the intermixing reaction in Co–Sn system from electroplated Co and Sn multilayers. Co–Sn couples were sequentially electroplated and reflowed at 400 °C for 1 and 4 h. The microstructure and composition of the phases formed at different reflow duration were characterized by field emission scanning electron microscopy (FESEM) coupled with energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). Mechanical properties of the IMC layers formed in the samples were characterized using the nanoindentation technique under quasi-static and continuous measurement modes. FESEM/EDX and XRD analysis showed a mixture of CoSn+CoSn2 phases was formed in the 1 h reflow sample. As reflow time was increased to 4 h, only CoSn phase was found. Pure CoSn phase exhibits high nanohardness of 9.51 GPa while the region with CoSn+CoSn2 phases gives nanohardness value of 6.83 GPa.

Item Type: Article
Uncontrolled Keywords: Continuous measurements; Energy dispersive X ray spectroscopy; Field emission scanning electron microscopy; Intermixing reactions; Metallurgical bonding process; Nanoindentation techniques; Transient liquid phase bonding; Under bump metallization
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 21 Aug 2019 06:38
Last Modified: 21 Aug 2019 06:38

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