Delayed volatiles release phenomenon at higher temperature in TGA via sample encapsulation technique

Ng, Andrew Kay Lup and Abnisa, Faisal and Daud, Wan Mohd Ashri Wan and Aroua, Mohamed Kheireddine Delayed volatiles release phenomenon at higher temperature in TGA via sample encapsulation technique. Fuel. ISSN 0016-2361,

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Thermogravimetric analysis (TGA) for solid-gas reactions is well formalized and of ubiquitous use. However, the use of volatile samples in TGA often results in pre-loss of volatile sample by evaporation prior to reaching the specified thermal conditions of analysis. Therefore, sample encapsulation method was proposed as an innovative technique to address this issue. This technique was shown to provide a continuous and delayed release of vaporized samples over the range of elevated temperature through the progressive loosening of the hermetic seal of metal capsule. This effect can be enhanced by using capsule with higher material hardness and smaller surface area for sample evaporation. Application of this method in catalytic phenol reduction has shown an increase in benzene yield from 19.2 mol% to 46.5 mol% when phenol is encapsulated by tin cylinder. Based on these findings, delayed volatiles release phenomenon may lead to further opportunities in the area of thermochemical kinetics study for fuel processing such as gasification, carbonization, reforming or petrochemical reactions that involve catalyst activation at high temperature and use of volatile samples such as fuel model compounds in TGA setup.

Item Type: Article
Funders: GSP-MOHE, University of Malaya: project number “MO008-2015”, Ministry of Higher Education of Malaysia (MOHE): MyBrain15 (MyPhD) program, IPPP: project “PG081-2016A”
Uncontrolled Keywords: Sample encapsulation; Hermetically sealed pan; Volatile sample; Thermogravimetric analysis; Catalytic solid-gas reaction
Subjects: T Technology > TP Chemical technology
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 19 Jul 2019 08:21
Last Modified: 19 Jul 2019 08:21

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