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Quadir, M.Z. and Singh, Gurbinder and Rickard, W.D.A. and Haseeb, A.S. Md. Abdul (2020) Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. Materials Letters, 259. p. 126833. ISSN 0167-577X, DOI https://doi.org/10.1016/j.matlet.2019.126833.
Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, M.R. and Munroe, P.R. and Quadir, M.Z. (2013) Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate. Intermetallics, 33. pp. 8-15. ISSN 0966-9795, DOI https://doi.org/10.1016/j.intermet.2012.09.016.
