Items where Author is "Ariga, T."

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Number of items: 6.


Kanlayasiri, K. and Ariga, T. (2015) Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate. Materials & Design, 86. pp. 371-378. ISSN 0261-3069

Basri, D.K. and Sisamouth, L. and Farazila, Y. and Miyazawa, Y. and Ariga, T. (2014) Brazeability and mechanical properties of Ag-Cu-Sn brazing filler metals on copper-brazed joint. Materials Research Innovations, 18 (S6). pp. 429-432.

Zaharinie, T. and Yusof, F. and Fadzil, M. and Hamdi, M. and Ariga, T. (2014) Microstructural analysis of brazing sapphire and inconel 600 for sensor applications. Materials Research Innovations, 18 (S6). pp. 68-72.

Othman, R. and Binh, D.N. and Ismail, A.B. and Long, B.D. and Ariga, T. (2012) Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints. Intermetallics, 22. pp. 1-6. ISSN 0966-9795

Sisamouth, L. and Hamdi, M. and Ariga, T. (2010) Investigation of gap filling ability of Ag-Cu-In brazing filler metals. Journal of Alloys and Compounds, 504 (2). pp. 325-329. ISSN 0925-8388

Dharma, I.G.B. and Hamdi, M. and Ariga, T. (2009) The effects of adding silver and indium to lead-free solders. Welding Journal, 88 (4). pp. 45-48. ISSN 0043-2296

This list was generated on Wed Jun 26 02:35:33 2019 +08.