Liu, Yan and Mansir, Ibrahim B. and Dahari, Mahidzal and Nguyen, Xuan Phuong and Abbas, Mohamed and Nguyen, Van Nhanh and Wae-hayee, Makatar (2022) Improvement of cooling of a high heat flux CPU by employing a cooper foam and NEPCM/water suspension. Journal of Energy Storage, 55 (C). ISSN 2352-152X, DOI https://doi.org/10.1016/j.est.2022.105682.
Full text not available from this repository.Abstract
In the current simulation, a copper porous media was inserted on a hot surface of a CPU releasing high heat flux and then embedded within a mini-channel. The working fluid was a mixture of water and Nano-encapsulated phase change material (NEPCM) with fusion temperature of 303.47 K. The proposed model was simulated by computational fluid dynamic (CFD) based on finite volume method (FVM) to evaluate the impacts of Reynolds number (Re = 80, 90, 100, 110, and 120), porous medium with different porosity number (epsilon = 0.9, 0.925, 0.95, 0.975, and 1). The important parameters in CPU cooling was selected including pressure drop and maximum temperature of CPU's surface. The evidence said that inserting a copper foam with 0.95 porosity can reduce the maximum temperature of CPU's surface and increase the pressure drop by 40 K and 100 times compared to without porous media, respectively. Also, rising Reynolds number from 80 to 120 enhanced the pressure drop by 57 % and decreased the maximum temperature of CPU's surface by only 5.4 K.
| Item Type: | Article |
|---|---|
| Funders: | King Khalid University (KKU) through the Research Group Program (Grant No: R.G.P.2/133/43) |
| Uncontrolled Keywords: | Nano-encapsulated phase change material; CFD simulation; Heat transfer process; Suspension; Mini-channel |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Faculty of Engineering > Department of Electrical Engineering |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 14 Nov 2023 04:49 |
| Last Modified: | 14 Nov 2023 04:49 |
| URI: | http://eprints.um.edu.my/id/eprint/40715 |
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