Effect of Plasma Treatment (He/CH4) on the Glass Surface for the Reduction of Powder Flux Adhesion in the Spray Drying Process

Ramlan, Nadiah and Mohd Zamri, Nazirah Wahidah and Maskat, Mohamad Yusof and Md Jamil, Mohd Suzeren and Chin, Oi Hoong and Lau, Yen Theng and Zubairi, Saiful Irwan (2018) Effect of Plasma Treatment (He/CH4) on the Glass Surface for the Reduction of Powder Flux Adhesion in the Spray Drying Process. Sains Malaysiana, 47 (6). pp. 1147-1155. ISSN 0126-6039, DOI https://doi.org/10.17576/jsm-2018-4706-10.

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Official URL: https://doi.org/10.17576/jsm-2018-4706-10

Abstract

A 50Hz glow discharge He/CH4 plasma was generated and applied for the glass surface modification to reduce the powder adhesion on wall of spray dryer. The hydrophobicity of the samples determined by the water droplet contact angle and adhesion weight on glass, dependent on the CH4 flow rate and plasma exposure time. The presence of CH3 groups and higher surface roughness of the plasma treated glass were the factors for its hydrophobicity development. Response surface methodology (RSM) results using central composite rotatable design (CCRD) showed that optimal responses were obtained by the combination of parameters, CH4 gas flow rate = 3 sccm and exposure time = 10 min. In optimum conditions, the contact angle increased by 47% and the weight of the adhesion reduced by 38% (w/w). The plasma treatment could enhance the value of the contact angle and thus reduced the adhesion on the spray dryer glass surface.

Item Type: Article
Funders: Ministry of Science, Technology and Innovation (MOSTI) and Ministry of Higher Education (MOHE), Malaysia: (06-01-02-SF1271, FRGS/2/2013/ TK04/UKM/03/1 and GGPM-2013-078)
Uncontrolled Keywords: Flux adhesion; hydrophobic; plasma treatment; powder; spray dryer; surface treatment
Subjects: Q Science > Q Science (General)
Q Science > QC Physics
Divisions: Faculty of Science > Department of Physics
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 16 Apr 2019 03:40
Last Modified: 16 Apr 2019 03:40
URI: http://eprints.um.edu.my/id/eprint/20926

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