Anodisation of copper in thiourea-containing acid solution - part II. in situ transversal imaging observations. kinetics of anodic film growth

Haseeb, A.S. Md. Abdul and Schilardi, P.L. and Bolzan, A.E. and Piatti, R.C.V. and Salvarezza, R.C. and Arvia, A.J. (2001) Anodisation of copper in thiourea-containing acid solution - part II. in situ transversal imaging observations. kinetics of anodic film growth. Journal of Electroanalytical Chemistry, 500 (1-2). pp. 543-553. ISSN 0022-0728

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Official URL: https://doi.org/10.1016/S0022-0728(00)00216-3

Abstract

The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E < 0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)-thiourea complexes, including the formation of a polymer-like Cu(I)-thiourea complex (film I), take place. For E > 0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)-thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height h obtained from in situ imaging. The kinetics of him I fit a parabolic rate law, whereas those of film II approach a linear h versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed. (C) 2001 Elsevier Science B.V. All rights reserved.

Item Type: Article
Additional Information: Haseeb, ASMA Schilardi, PL Bolzan, AE Piatti, RCV Salvarezza, RC Arvia, AJ Si
Uncontrolled Keywords: Anodic copper dissolution; Thiourea; Corrosion inhibitor
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering
Depositing User: Mr. Mohammed Salim Abd Rahman
Date Deposited: 18 Apr 2013 00:23
Last Modified: 16 Oct 2018 04:25
URI: http://eprints.um.edu.my/id/eprint/5780

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