Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications

Haj-Taieb, M. and Haseeb, A.S. Md. Abdul and Caulfield, J. and Bade, Klaus and Aktaa, J. and Hemker, K.J. (2008) Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications. Microsystem Technologies, 14 (9-11). pp. 1531-1536. ISSN 0946-7076

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Official URL: https://doi.org/10.1007/s00542-007-0536-5

Abstract

For thermally stable LIGA materials for high temperature MEMS applications LIGA Ni-W layers and micro testing samples with different compositions (15 and 5 at W) were electrodeposited. In order to investigate the thermal stability the Ni-W layers were annealed at different temperatures (300-700 degrees C) and for different durations (1, 4, 16 h). Their microstructure and micro-hardness were than analysed after annealing and compared with those of as-deposited states. The observed microstructures show, in comparison to pure LIGA nickel, a small grain growth and a relatively stable structure up to 700 degrees C. The micro-hardness values of the LIGA Ni-W layers are higher than those of the pure LIGA nickel. The micro-hardness measurements for high W-content show in addition a low decrease of the hardness values with increase of the annealing duration. Tensile tests were carried out for each composition (5 and 15 at). Ni-W shows higher strength (UTS) above 750 MPa and 1,000 MPa, respectively and lower ductility than pure nickel.

Item Type: Article
Additional Information: Haj-Taieb, M. Haseeb, A. S. M. A. Caulfield, J. Bade, K. Aktaa, J. Hemker, K. J. 7th International Workshop on High-Aspect-Ratio Micro-Structure Technology Jun 07-09, 2007 Besancon, FRANCE
Uncontrolled Keywords: Pure Nickel; Annealing Duration; Nickel Sulphate; High Tungsten Content; Tomographic Atom Probe
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering
Depositing User: Mr. Mohammed Salim Abd Rahman
Date Deposited: 18 Apr 2013 00:19
Last Modified: 16 Oct 2018 04:56
URI: http://eprints.um.edu.my/id/eprint/5758

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