Thermal characteristic of sintered Ag-Cu nanopaste for high-temperature die-attach application

Tan, K.S. and Wong, Y.H. and Cheong, K.Y. (2015) Thermal characteristic of sintered Ag-Cu nanopaste for high-temperature die-attach application. International Journal of Thermal Sciences, 87. pp. 169-177. ISSN 1290-0729

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In this work, thermal characteristic of silver-copper (Ag-Cu) nanopaste that consists of a mixture of nano-sized Ag and Cu particles and organic compounds meant for high-temperature die-attach application is reported. The Ag-Cu nanopaste was sintered at 380 degrees C for 30 min without the need of applying external pressure and the effect of Cu loading (20-80 wt) on the thermal properties was investigated in against of pure Ag nanopaste and pure Cu nanopaste. The results showed the specific heat of sintered Ag-Cu nanopaste was increased as the loading of Cu increased. For thermal conductivity and coefficient of thermal expansion (CTE) of sintered Ag-Cu nanopaste, a declining trend has been recorded with the increment of Cu loading. Overall, the sintered Ag-Cu nanopaste with 20 wt of Cu loading has demonstrated the best combination of thermal conductivity (K) and CTE (alpha), which were 159 W/m K and 13 x 10(-6)/K, respectively. It has proven that there was a strong correlation between the amount of pores and thermal properties of the nanopaste. The ratio of K/alpha is a performance index (M), which has shown a higher value (12.2 x 10(6) W/m) than most of the commonly used die-attach systems. Finally, the Ag-Cu nanopaste has demonstrated a melting point of 955 degrees C, which can be proposed as an alternative high-temperature die-attach material. (C) 2014 Elsevier Masson SAS. All rights reserved.

Item Type: Article
Additional Information: As7hm Times Cited:0 Cited References Count:56
Uncontrolled Keywords: Melting temperature, thermal conductivity, coefficient of thermal expansion, performance index, sintering, lead-free solders, differential scanning calorimetry, wide bandgap semiconductors, organic additives content, silver-copper nanopaste, pb-free solder, power devices, conductive adhesives, migration, pressure,
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Mr Jenal S
Date Deposited: 20 Sep 2015 23:52
Last Modified: 20 Sep 2015 23:52

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