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A

Arafat, M.M. and Haseeb, A.S. Md. Abdul and Johan, M.R. (2011) Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles. Soldering & Surface Mount Technology, 23 (3). pp. 140-149. ISSN 0954-0911,

C

Chew, C.S. and Durairaj, R. and Haseeb, A.S. Md. Abdul and Beake, B. (2015) Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation. Soldering & Surface Mount Technology, 27 (2). pp. 90-94. ISSN 0954-0911, DOI https://doi.org/10.1108/Ssmt-01-2015-0001.

G

Goh, Y. and Haseeb, A.S. Md. Abdul and Sabri, M.F.M. (2013) Electrodeposition of lead‐free solder alloys. Soldering & Surface Mount Technology, 25 (2). pp. 76-90. ISSN 0954-0911, DOI https://doi.org/10.1108/09540911311309031.

I

Ismail, Norliza and Jalar, Azman and Abu Bakar, Maria and Ismail, Roslina and Ibrahim, Najib Saedi (2020) Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu. Soldering & Surface Mount Technology, 32 (3). pp. 157-164. ISSN 0954-0911, DOI https://doi.org/10.1108/SSMT-07-2019-0024.

K

Kamaruzzaman, Lina Syazwana and Goh, Yingxin (2022) Effects of alloying element on mechanical properties of Sn-Bi solder alloys: A review. Soldering & Surface Mount Technology, 34 (5). pp. 300-318. ISSN 0954-0911, DOI https://doi.org/10.1108/SSMT-06-2021-0035.

T

Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, M.R. (2011) Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing. Soldering & Surface Mount Technology, 23 (1). pp. 10-14. ISSN 0954-0911,