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Wakeel, Saif and Haseeb, A. S. Md. Abdul and Amalina, Muhammad Afifi and Hoon, Khoo Ly (2022) Investigation into chemistry and performance of no-clean flux in fine pitch flip-chip package. IEEE Transactions on Components Packaging and Manufacturing Technology, 12 (1). pp. 155-167. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2021.3109885.
Mohd Zahri, Nur Amirah and Yusof, Farazila and Badruddin, Irfan Anjum and Haseeb, A. S. Md. Abdul and Sukiman, Nazatul Liana and Kamangar, Sarfaraz (2021) Deformation and fracture behavior of sandwiched copper foam brazed joint using amorphous copper-tin-nickel-phosphorus filler. Frontiers in Materials, 8. ISSN 2296-8016, DOI https://doi.org/10.3389/fmats.2021.665219.