Items where Author is "Chia, Pay Ying"

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Goh, Yi Sing and Goh, Yingxin and Chia, Pay Ying and Haseeb, A. S. M. A. (2021) Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu-Sn-Co multilayers. Journal of Materials Science: Materials in Electronics, 32 (7). pp. 9490-9499. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-021-05612-3.

Haseeb, A.S. Md. Abdul and Rahman, Abu Zayed Mohammad Saliqur and Chia, Pay Ying (2018) Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film. Journal of Materials Science: Materials in Electronics, 29 (2). pp. 1258-1263. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-017-8030-z.

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