Ismail, Norliza and Jalar, Azman and Abu Bakar, Maria and Ismail, Roslina and Ibrahim, Najib Saedi (2020) Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu. Soldering & Surface Mount Technology, 32 (3). pp. 157-164. ISSN 0954-0911, DOI https://doi.org/10.1108/SSMT-07-2019-0024.
Full text not available from this repository.Abstract
Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes. Design/methodology/approach Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder paste. The solder pastes were then subjected to stencil printing and reflow process. Solderability was investigated via contact angle analysis and the thickness of cross-sectionally intermetallic layer. Findings It was found that different functional groups from different fluxes showed different physical behaviour, indicated by contact angle value and IMC layer thickness. ``Aromatic contain'' functional group lowering the contact angle while non-aromatic contain functional group lowering the thickness of IMC layer. The higher the CNT wt.%, the lower the contact angle and IMC layer thickness, regardless of different fluxes. Relationship between contact angle and IMC layer thickness is found to have distinguished region because of different fluxes. Thus it may be used as guidance in flux selection for solder paste formulation. Originality/value The quality of solder joint of SAC305/CNT/Cu system, as indicated by contact angle and the thickness of IMC layer formation, depends on existence of functional group of the fluxes.
| Item Type: | Article |
|---|---|
| Funders: | Ministry of Higher Education, Malaysia [Grant No: FRGS/1/2019/STG07/UKM/03/1], Universiti Kebangsaan Malaysia [Grant No: MI-2018-019] |
| Uncontrolled Keywords: | Sn-Ag-Cu; Solder paste; CNT; Flux; Wettability; IMC layer thickness; Functional group |
| Subjects: | Q Science > Q Science (General) Q Science > QC Physics |
| Divisions: | Faculty of Creative Arts (formerly known as the Cultural Centre) |
| Depositing User: | Ms Zaharah Ramly |
| Date Deposited: | 06 Nov 2024 03:43 |
| Last Modified: | 06 Nov 2024 03:43 |
| URI: | http://eprints.um.edu.my/id/eprint/36894 |
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