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Jaffery, Syed Hassan Abbas and Sabri, Mohd Faizul Mohd and Rozali, Shaifulazuar and Hasan, Syed Waqar and Mahdavifard, Mohammad Hossein and AL-Zubiady, Dhafer Abdul-ameer Shnawah and Ravuri, Balaji Rao (2022) Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi. Microelectronics Reliability, 139. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2022.114802.
Ali, Bakhtiar and Sabri, Mohd Faizul Mohd and Said, Suhana Mohd and Sukiman, Nazatul Liana and Jauhari, Iswadi and Mahdavifard, Mohammad Hossein (2018) Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectronics Reliability, 82. pp. 171-178. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2018.01.015.
