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Goh, Y. and Haseeb, A.S. Md. Abdul (2016) Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin. Journal of Materials Science, 51 (12). pp. 5823-5833. ISSN 0022-2461, DOI https://doi.org/10.1007/s10853-016-9883-x.
Goh, Y. and Haseeb, A.S. Md. Abdul and Liew, H.L. and Sabri, M.F.M. (2015) Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints. Journal of Materials Science, 50 (12). pp. 4258-4269. ISSN 0361-5235, DOI https://doi.org/10.1007/s10853-015-8978-0.
Goh, Y. and Haseeb, A.S. Md. Abdul and Sabri, Mohd Faizul Mohd (2013) Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder. Electrochimica Acta, 90. pp. 265-273. ISSN 0013-4686, DOI https://doi.org/10.1016/j.electacta.2012.12.036.
Goh, Y. and Haseeb, A.S. Md. Abdul and Sabri, M.F.M. (2013) Electrodeposition of lead‐free solder alloys. Soldering & Surface Mount Technology, 25 (2). pp. 76-90. ISSN 0954-0911, DOI https://doi.org/10.1108/09540911311309031.
