Ayat, F.L. and Moghavvemi, M. and Attaran, A. (2011) Thickness effect of micro speaker copper coil fabrication process. Sensors and Transducers, 130 (7). pp. 127-135. ISSN 17265479,
Full text not available from this repository.Abstract
This paper present the advantage of using electroplating for making the thick layer of copper over the sputtering. The purpose of this paper is to fabricate the copper coil for microspeaker. The design and simulation of this copper coil shows that the 15 um thickness is needed. In order to fabricate this coil, copper plating is used. The electro-deposition process is well suited to make films of metals such as copper, gold and nickel. The films can be made in any thickness from ~1 μm to >100 μm. The deposition is best controlled when used with an external electrical potentiostate. However, it requires electrical contact to the substrate when immersed in the liquid bath. In any process, the surface of the substrate must have an electrically conducting coating before the deposition can be done. The result of this experimental research shows the easy and cheap way to fabricate the thick layer of copper for microspeacker fabrication.
| Item Type: | Article |
|---|---|
| Funders: | UNSPECIFIED |
| Uncontrolled Keywords: | Cupper coil; Electroplating; Microspeaker; Sputtering; Conducting coating; Copper coils; Cupper coil; Design and simulation; Electrical contacts; Experimental research; Fabrication process; Liquid baths; Microspeakers; Thick layers; Thickness effect; Copper plating; Electroplating; Gold coatings; Gold deposits; Sputtering |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Divisions: | Faculty of Engineering |
| Depositing User: | Ms. Norhamizah Tamizi |
| Date Deposited: | 27 Mar 2014 01:46 |
| Last Modified: | 23 Nov 2017 03:22 |
| URI: | http://eprints.um.edu.my/id/eprint/9743 |
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