Kamaruzzaman, Lina Syazwana and Goh, Yingxin (2023) Microstructure and tensile properties of Sn-Bi-Co solder alloy. Journal of Materials Science: Materials in Electronics, 34 (4). ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-022-09683-8.
Full text not available from this repository.Abstract
Sn-Bi solder is one of the promising lead-free alternatives because it offers advantages such as low melting temperature, low cost, and good tensile strength. Unfortunately, the microstructure coarsening tendency in Sn-Bi solder leads to the embrittlement and reliability. Cobalt (Co) as an alloying element shows potential in improving the properties of Sn-Bi solder. In this study, the effects of Co addition as alloying element using the doped flux technique are investigated. The Sn-58Bi-Co solder melting temperature, microstructure, intermetallic compounds (IMCs) formation, and tensile properties are studied. Differential scanning calorimeter (DSC) analysis shows that, the addition of 1.0-2.0 wt% of Co to Sn-58Bi solder increases the melting temperature marginally in the range of 1.49 to 4.61 degrees C. The IMC layer thickness between Sn-58Bi-xCo solder and Cu substrate was measured using Olympus SZX10 AnalySIS software. The lowest thickness of Cu6Sn5 and Cu3Sn IMC layer was recorded for Sn-58Bi-1.5Co/Cu solder joint with 3.58 +/- 0.33 mu m. The presence of Co was also observed the flatten morphology of IMC layers. In terms of mechanical properties, Sn-58Bi-1.5Co solder showed the optimal tensile strength of 60.29 +/- 0.18 MPa and modulus of elasticity of 4.14 +/- 0.31 GPa, compared to 57.02 +/- 0.39 MPa tensile strength and 4.17 +/- 0.76 GPa modulus of elasticity of the control pure Sn-Bi solder. By addition of Co alloying element, it is highly anticipated that this new Sn-Bi-Co alloy can be applied in low-temperature soldering and heat-sensitive electronic devices, in an effort to replace lead-containing solder alloy.
| Item Type: | Article |
|---|---|
| Funders: | Universiti Malaya Faculty Research Grant (GPF046A-2019) |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Engineering > Department of Mechanical Engineering Universiti Malaya |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 30 Oct 2025 09:03 |
| Last Modified: | 30 Oct 2025 09:03 |
| URI: | http://eprints.um.edu.my/id/eprint/49919 |
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