Abu Bakar, Amnani and Hashim, N. H. and Tajuddin, H. A. and Sadun, A. S. and Abidin, Z. H. Z. (2025) Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion. Current Applied Physics, 71. pp. 138-143. ISSN 1567-1739, DOI https://doi.org/10.1016/j.cap.2025.01.002.
Full text not available from this repository.Abstract
Achieving robust adhesion and cost-efficiency in silver (Ag) thin films is pivotal for advancing microelectronic applications, owing to Ag's exceptional low resistivity and thermal stability. This study investigates an optimized approach to hydroxylate glass substrates, effectively eliminating the reliance on conventional adhesive layers. Among five chemical cleaning methods evaluated, immersion in concentrated H2SO4, followed by thorough rinsing with deionized water and ultrasonication in ethanol, emerged as the most effective. This method produced highly hydrophilic surfaces with a contact angle (CA) of 6.6 degrees. The resulting Ag films, deposited via physical vapor deposition, demonstrated excellent adhesion without peeling, while also exhibiting smooth and uniform surfaces ideal for subsequent functionalization. By streamlining substrate preparation, this methodology enhances the fabrication efficiency of high-performance microelectronic devices, offering a practical and scalable solution for industrial applications.
| Item Type: | Article |
|---|---|
| Funders: | Ministry of Higher Education (MOHE) through Fundamental Research Grant Scheme (FRGS/1/2020/TK0/UTHM/02/42) |
| Uncontrolled Keywords: | Cleaning method; Glass surface; Silver; Contact angle; Thin film layer |
| Subjects: | Q Science > Q Science (General) Q Science > QC Physics Q Science > QD Chemistry |
| Divisions: | Faculty of Science > Department of Chemistry Faculty of Science > Department of Physics |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 13 Mar 2025 07:30 |
| Last Modified: | 14 Mar 2025 01:01 |
| URI: | http://eprints.um.edu.my/id/eprint/47720 |
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