Razizy, F. Muhamad and Azlina, O. Saliza and Farazila, Y. (2024) Interfacial reaction on different solder composition after laser soldering. Materialwissenschaft und Werkstofftechnik, 55 (11). pp. 1484-1490. ISSN 0933-5137, DOI https://doi.org/10.1002/mawe.202200320.
Full text not available from this repository.Abstract
This study used electroless nickel-immersion gold surface finish. The lead free solder used are tin-silver-copper 305 and tin-silver-copper 307 solder alloys. The difference in copper composition will affect the intermetallic compound ` s microstructure after the laser soldering process. The intermetallic compound formation analysis reveals that only (Cu, Ni)6Sn5 was observed at the solder joint interface for both solders after laser soldering. The grain microstructure of tin-silver-copper 305 formed is rounded-shaped and bar-shaped, while tin-silver-copper 307 shapes are oval-shaped and flake-like. However, for cross-sectioned analysis, the intermetallic compound grain microstructure formed at the solder joint formation was (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 presented in dendrite-like and scale-like shapes. This result shows that copper content in solder composition is directly affected the intermetallic compound grain microstructure. When exposed to the ageing process, the intermetallic compound thickness will increase directly with ageing time. The intermetallic compound thickness for tin-silver-copper 305 was increased from 0.98 mu m to 8.34 mu m while tin-silver-copper 307 was increased from 1.54 mu m to 8.76 mu m. The result also shows that nano-sized of Ag3Sn grain particle was formed on the intermetallic compound surface after an ageing process for both samples, tin-silver-copper 305 and tin-silver-copper 307.
| Item Type: | Article |
|---|---|
| Funders: | Ministry of Higher Education Malaysia (MOHE) through Fundamental Research Grant Scheme ((FRGS/1/2019/TK03/UTHM/02/6)1), Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia |
| Uncontrolled Keywords: | ageing; electroless nickel; immersion gold; intermetallic compounds; laser soldering; lead-free solder; Alterung; bleifreies Lot; Chemisch Nickel; intermetallische Verbindungen; Laserstrahll & ouml;ten; Tauchgold |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Engineering |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 20 Feb 2025 04:55 |
| Last Modified: | 20 Feb 2025 04:55 |
| URI: | http://eprints.um.edu.my/id/eprint/47326 |
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