Bashir, Muhammad Nasir and Butt, Sajid Ullah and Mansoor, Muhammad Adil and Khan, Niaz Bahadur and Bashir, Shahid and Wong, Yew Hoong and Alamro, Turki and Eldin, Sayed Mohamed and Jameel, Mohammed (2022) Role of crystallographic orientation of β-sn grain on electromigration failures in lead-free solder joint: An overview. Coatings, 12 (11). ISSN 2079-6412, DOI https://doi.org/10.3390/coatings12111752.
Full text not available from this repository.Abstract
Due to the miniaturization of electronic devices, electromigration became one of the serious reliability issues in lead-free solder joints. The orientation of the beta-Sn grain plays an important role in electromigration failures. Several studies have been carried out to investigate the effect of Sn grain orientation on electromigration. The efforts involve the influence of beta-Sn grain orientation on the migration of Cu, Sn, and Ni atoms, on the morphology of the solder joint, and on the formation of Cu6Sn5 and (Cu, Ni)6Sn6 in the lead-free solder joint during electromigration. The current review provides a detailed review of past studies which were conducted to investigate the influence of beta-Sn grain orientation on electromigration failures in lead-free solder joints.
| Item Type: | Article |
|---|---|
| Funders: | Institute of Research Management & Services (IPPP) university of Malaya Kuala Lumpur Malaysia, deanship of scientific research at King Khalid University [RGP] |
| Uncontrolled Keywords: | beta-Sn grain; intermetallic compound; lead-free solder joint; electromigration |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Engineering > Department of Mechanical Engineering Deputy Vice Chancellor (Research & Innovation) Office > UM Power Energy Dedicated Advanced Centre |
| Depositing User: | Ms Koh Ai Peng |
| Date Deposited: | 22 Oct 2024 07:16 |
| Last Modified: | 22 Oct 2024 07:16 |
| URI: | http://eprints.um.edu.my/id/eprint/46193 |
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