Zahri, Nur Amirah Mohd and Yusof, Farazila and Miyashita, Yukio and Ariga, Tadashi and Abdul, Haseeb and Sukiman, Nazatul Liana (2022) Effect of porous copper pore density on joint interface: microstructure and mechanical analysis. Journal of Harbin Institute of Technology (New Series), 29 (1). 24 – 31. ISSN 10059113, DOI https://doi.org/10.11916/j.issn.1005-9113.2020056.
Full text not available from this repository.Abstract
The effect of the pore density of porous copper (Cu) on brazed Cu/porous Cu was investigated. A filler with a composition of Cu-9.0Sn-7.0Ni-6.0P (Sn: Tin; Ni: Nickel; P: Phosphorus) and porous Cu with pore densities of 15 pores per inch (PPI), 25 PPI, and 50 PPI were employed. The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures. Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The micro-hardness test of Cu/porous Cu joint interface showed a high hardness value (HV) for 50 PPI porous Cu. This result was in line with its low shear strength. It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu3P and Ni3P in the brazed interface. Copyright and License information: Journal of Harbin Institute of Technology (New Series) 2022
Item Type: | Article |
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Funders: | FRGS University of Malaya [Grant No; FP062-2015A], Universiti Malaya [Grant No; ST006-2018] |
Uncontrolled Keywords: | Brazing; Interface microstructure; Porous metal; Shear fracture |
Subjects: | T Technology > TJ Mechanical engineering and machinery |
Divisions: | Faculty of Engineering > Department of Mechanical Engineering |
Depositing User: | Ms. Juhaida Abd Rahim |
Date Deposited: | 09 Nov 2023 03:12 |
Last Modified: | 09 Nov 2023 03:12 |
URI: | http://eprints.um.edu.my/id/eprint/43391 |
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