Bashir, M. Nasir and Haseeb, A. S. Md Abdul and Wakeel, Saif and Khan, Muhammad Ali and Quazi, M. M. and Khan, Niaz Bahadur and Ahmed, Arslan and Soudagar, Manzoore Elahi M. (2022) Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix. Journal of Materials Science-Materials in Electronics, 33 (25). pp. 20106-20120. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-022-08827-0.
Full text not available from this repository.Abstract
Microstructure of the eutectic region and beta-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and beta-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of beta-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of beta-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint.
| Item Type: | Article |
|---|---|
| Funders: | Universiti Malaya, Malaysian Ministry of Higher Education, Malaysia [D000026-16001] |
| Uncontrolled Keywords: | Lead-free solder; SN-AG-CU; Interfacial intermetallic compounds |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Engineering |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 19 Sep 2023 06:59 |
| Last Modified: | 19 Sep 2023 06:59 |
| URI: | http://eprints.um.edu.my/id/eprint/41339 |
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