Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri (2022) Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging. Materials Today Communications, 33. ISSN 2352-4928, DOI https://doi.org/10.1016/j.mtcomm.2022.104430.
Full text not available from this repository.Abstract
Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi), Antimony (Sb), Nickel (Ni) etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated to improve their reliability. The additional elements can bring about the improvements through solid solution and precipitation strengthening. In this study, the effects of simultaneous additions of Bi, Sb and Ni to SAC 305 solder on the evolution of microstructure and mechanical properties of the solder under thermal aging at 125 degrees C for up to 1008 h are investigated. Superior microstructural stability and improved mechanical strength of the multicomponent alloy at long aging time and its fracture behavior are discussed.
| Item Type: | Article |
|---|---|
| Funders: | Malaysia Collaborative Research in Engineering, Science Technology [P09C3-14], Universiti Malaya [RK007-2018] |
| Uncontrolled Keywords: | Multicomponent solder; Tensile strength; SAC305; Thermal aging; Microstructure |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Engineering |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 25 Sep 2023 06:27 |
| Last Modified: | 25 Sep 2023 06:27 |
| URI: | http://eprints.um.edu.my/id/eprint/40892 |
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