Yang, Fan and Liu, Qiulin and Li, Guodong and Zhang, Xiaofan and Rozali, Shaifulazuar and Nik Ghazali, Nik Nazri and Mohd Sabri, Mohd Faizul and Zhao, Huaizhou (2022) Effect of additives and optimized Cyclic voltammetry parameters on the morphology of electrodeposited Tellurium thin film. Journal of Electroanalytical Chemistry, 925. ISSN 1572-6657, DOI https://doi.org/10.1016/j.jelechem.2022.116872.
Full text not available from this repository.Abstract
Thin film technologies in terms of preparation and fabrication are of great importance in various fields, such as integrated circuits (IC), LCD monitors, photovoltaics, solar cells and sensors. Tellurium, as a narrow bandgap semiconductor, has attracted much attention due to its rich optical and electrical properties. Taking advantage of these properties, its films have been explored in recent years as saturable absorbers, gas sensors, and ther-moelectric materials. However, it is challenging to control the growth of the specific morphology of tellurium films. In this work, based on the electrodeposition challenge, we systematically investigated the electrodepo-sition process of tellurium films. It was found that the CV curves of electrodeposited tellurium shift in the pos-itive direction with increasing deposition time. In addition, the stabilized potential was determined based on the stable deposition peak potential after a certain deposition time. Moreover, three different additives, namely polyvinyl alcohol (PVA), tartaric acid (TA) and sodium lignosulfonate (SLS), were adopted to manipulate the morphology of as-deposited tellurium films. A rational route to deposit tellurium films with various morpholo-gies have been established.
Item Type: | Article |
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Funders: | National Key Research and Development Program of China (Grant No: 2021YFA0718700), National Natural Science Foundation of China (NSFC) (Grant No: 52172259), Institute of Physics of the Chinese Academy of Sciences, Faculty of Engineering, Universiti Malaya, Malaysia |
Uncontrolled Keywords: | Electrochemical deposition; Temperature; Performance; Improvement; Alcohol; Copper; Acid |
Subjects: | T Technology > TJ Mechanical engineering and machinery |
Divisions: | Faculty of Engineering > Department of Mechanical Engineering |
Depositing User: | Ms. Juhaida Abd Rahim |
Date Deposited: | 22 Nov 2023 06:49 |
Last Modified: | 22 Nov 2023 06:49 |
URI: | http://eprints.um.edu.my/id/eprint/40385 |
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