Islam, Mohammad Aminul and Low, Foo Wah and Tiong, Sieh Kiong and Said, Suhana Binti Mohd and Muhammad, Ghulam and Akhtaruzzaman, Md. and Amin, Nowshad (2021) The viability of alternative and nontoxic chlorine containing compounds for thermal treatment of ultrathin CdTe (<= 1.0 mu m) films. International Journal of Energy Research, 45 (9). pp. 13771-13785. ISSN 0363-907X, DOI https://doi.org/10.1002/er.6705.
Full text not available from this repository.Abstract
A detailed comparative analysis using alternative Cl compounds such as InCl2, MgCl2, SnCl2, and ZnCl2 along with CdCl2 was conducted in this study to assess their viability for the thermal treatment of ultrathin CdTe films. Similar or even better structural and electrical properties were found upon using InCl2, MgCl2, and ZnCl2 in thermal treatment than the conventional CdCl2. The film's bandgap is found to reduce upon the thermal treatment which varied in the range of 1.44-1.50eV. A low amount of metal doping occurred in films' surfaces upon thermal treatment and influence the carrier concentration which varied from 7.32 x10(15)-1.76 x10(17)/cm(3). The viability of the alternate materials was also investigated through the device simulation. All investigated results indicated that MgCl2 and ZnCl2 can be used in the current manufacturing technique instead of traditional CdCl2, which could reduce the environmental risk and production cost.
Item Type: | Article |
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Funders: | Universiti Tenaga Nasional (@The National Energy University), Malaysia, Institute of Sustainable Energy (ISE), Malaysian ministry of higher education through FRGS[FRGS/1/2020/TK0/UM/02/33] |
Uncontrolled Keywords: | Device simulation;Nontoxic Cl compound;Physical parameters;Raman study;Thermal treatment;Ultrathin CdTe |
Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
Divisions: | Faculty of Engineering |
Depositing User: | Ms Zaharah Ramly |
Date Deposited: | 18 Aug 2022 04:24 |
Last Modified: | 18 Aug 2022 04:24 |
URI: | http://eprints.um.edu.my/id/eprint/28829 |
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