Synergistic strengthening mechanisms of copper matrix composites with TiO2 nanoparticles

Bahador, Abdollah and Umeda, Junko and Hamzah, Esah and Yusof, Farazila and Li, Xiaochun and Kondoh, Katsuyoshi (2020) Synergistic strengthening mechanisms of copper matrix composites with TiO2 nanoparticles. Materials Science and Engineering: A, 772. p. 138797. ISSN 0921-5093

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Official URL: https://doi.org/10.1016/j.msea.2019.138797

Abstract

The trade-off between strength and ductility has been a dilemma in copper matrix composites. In this work, we introduce a way of strengthening copper matrix composites containing TiO2 nanoparticles with remarkable ductility. The Cu–8wt%TiO2 composites were fabricated using the powder metallurgy route with spark plasma sintering (SPS) for different holding times incorporating hot extrusion. The sintered composites for longer holding times showed an inhomogeneous distribution of large dispersed particles located mostly along the grain boundaries. However, tensile strength was improved compared with pure copper while ductility was reduced. In contrast, after hot extrusion, a homogeneous distribution of reinforcement particles and grain refinement concurrently triggered strong strengthening and enhanced ductility. The contribution of synergistic strengthening mechanisms, i.e. Hall–Petch strengthening, Orowan pinning, dislocation density and load transfer effect, was studied and the key strengthening mechanisms were elucidated. It was found that composite yielding was strongly affected by sintering time, particulate size and interparticle spacing so that HExt-SPS@30min composite presented the excellent yield strength of 290 MPa, about 72% above pure copper. © 2019 Elsevier B.V.

Item Type: Article
Uncontrolled Keywords: Cu–TiO2 composite; Particle reinforcement; Powder metallurgy; Spark plasma sintering
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 04 Oct 2021 06:54
Last Modified: 04 Oct 2021 06:54
URI: http://eprints.um.edu.my/id/eprint/26047

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