Performances and procedures modules in micro electro mechanical system packaging technologies

Amiri, Iraj Sadegh and Ariannejad, Mohammad Mahdi and Vigneswaran, Dhasarathan and Lim, Chin Seong and Yupapin, Preecha Promphan (2018) Performances and procedures modules in micro electro mechanical system packaging technologies. Results in Physics, 11. pp. 306-314. ISSN 2211-3797

Full text not available from this repository.
Official URL: https://doi.org/10.1016/j.rinp.2018.09.008

Abstract

This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS technology applications in general domains are automotive, consumer, industrial, biotechnology and commercial applications. Few methods such as the low power oven, vacuum, and silicon glass packages were discussed. The major technique as die level and wafer level of packing including thin-film packing were reviewed in this paper. The problem of several failure mechanisms and challenges and their solutions were discussed in this review.

Item Type: Article
Uncontrolled Keywords: Micro electro mechanical system (MEMS); Die-level packaging; Thin-film packing; Vacuum package
Subjects: Q Science > QC Physics
T Technology > TJ Mechanical engineering and machinery
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Deputy Vice Chancellor (Research & Innovation) Office > Photonics Research Centre
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 23 Sep 2019 07:45
Last Modified: 23 Sep 2019 07:45
URI: http://eprints.um.edu.my/id/eprint/22495

Actions (login required)

View Item View Item