Amiri, Iraj Sadegh and Ariannejad, Mohammad Mahdi and Vigneswaran, Dhasarathan and Lim, Chin Seong and Yupapin, Preecha Promphan (2018) Performances and procedures modules in micro electro mechanical system packaging technologies. Results in Physics, 11. pp. 306-314. ISSN 2211-3797, DOI https://doi.org/10.1016/j.rinp.2018.09.008.
Full text not available from this repository.Abstract
This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS technology applications in general domains are automotive, consumer, industrial, biotechnology and commercial applications. Few methods such as the low power oven, vacuum, and silicon glass packages were discussed. The major technique as die level and wafer level of packing including thin-film packing were reviewed in this paper. The problem of several failure mechanisms and challenges and their solutions were discussed in this review.
| Item Type: | Article |
|---|---|
| Funders: | UNSPECIFIED |
| Uncontrolled Keywords: | Micro electro mechanical system (MEMS); Die-level packaging; Thin-film packing; Vacuum package |
| Subjects: | Q Science > QC Physics T Technology > TJ Mechanical engineering and machinery T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Deputy Vice Chancellor (Research & Innovation) Office > Photonics Research Centre |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 23 Sep 2019 07:45 |
| Last Modified: | 23 Sep 2019 07:45 |
| URI: | http://eprints.um.edu.my/id/eprint/22495 |
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