Yamashita, Naomi and Ota, Yuya and Salleh, Faiz and Navaneethan, Mani and Shimomura, Masaru and Murakami, Kenji and Ikeda, Hiroya (2018) Simulation of Temperature Distribution under Periodic Heating for Analysis of Thermal Diffusivity in Nanometer-Scale Thermoelectric Materials. IEICE Transactions on Electronics, E101.C (5). pp. 347-350. ISSN 0916-8524, DOI https://doi.org/10.1587/transele.E101.C.347.
Full text not available from this repository.Abstract
With the aim of characterizing the thermal conductivity for nanometer-scale thermoelectric materials, we have constructed a new measurement system based on ac calorimetry. Analysis of the obtained data requires time-evolution of temperature distribution in nanometerscale material under periodic heating. In this study, we made a simulation using a C#-program for time-dependent temperature distribution, based on 2-dimensional heat-diffusion equation inclu1ding the influence of heat emission from material edges. The simulation was applied to AlN with millimeter-scale dimensions for confirming the validity and accuracy. The simulated thermal diffusivity for 10×75-mm2-area AlN was 1.3×10-4 m2/s, which was larger than the value set in the heat-diffusion equation. This overestimation was also observed in the experiment. Therefore, our simulation can reproduce the unsteady heat conduction and be used for analyzing the ac calorimetry experiment.
| Item Type: | Article |
|---|---|
| Funders: | This work was financially supported in part by a Japan Science and Technology Agency |
| Uncontrolled Keywords: | thermal diffusivity; ac calorimetry; heat diffusion equation; AlN |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Faculty of Engineering |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 14 Feb 2019 08:27 |
| Last Modified: | 14 Feb 2019 08:27 |
| URI: | http://eprints.um.edu.my/id/eprint/20323 |
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